As software becomes an increasingly important differentiator and component of autonomous driving, the term 'end-to-end' has been used to describe a new approach to autonomous driving software. End-to-end autonomous driving systems are defined by the input of raw sensor data into a deep learning model, and outputting vehicle control commands such as steering, acceleration, and braking. This represents a paradigm shift from the traditional modular software approach used in autonomous vehicles.

The demand for scalable and efficient storage is at an all-time high, with the strain on data centers becoming increasingly apparent. This article explores sustainable innovations for data centers, alongside cooling technologies.

Helium is favored for cryogenic applications and temperatures close to absolute zero due to its chemical inertness. This article explores different approaches to sourcing helium and its uses in semiconductor manufacturing.

IDTechEx has been studying RFID for over two decades and have just released our latest version of the RFID market research report: "RFID 2026-2036: Forecasts, Players and Opportunities". This report is built on our expertise, covering the latest RFID development trends, key player analysis, and market outlook. The report provides an unbiased review of RFID technology, companies, applications, and the market, providing the reader with a unique insight into the whole RFID sector, including its current state and future possibilities.

The automotive industry is undergoing a foundational shift toward Software-Defined Vehicles (SDVs), where vehicle functionality, user experience, and monetization opportunities are governed increasingly by software rather than hardware. This evolution, captured comprehensively in the latest IDTechEx report, "Software-Defined Vehicles, Connected Cars, and AI in Cars 2026-2036: Markets, Trends, and Forecasts", highlights how central compute and zonal platforms will redefine automotive competition, generating an estimated US$755 billion in hardware revenue by 2029.

In this article, IDTechEx analyzes how the quantum computing market has commercialized over recent years and the milestones for commercial value that lie ahead. In particular, how the transition into HPC facilities and data centers has accelerated the uptake of quantum hardware.

Making the call to order a coffee on-the-go could be the new normal for vehicles fitted with in-cabin sensing features and artificial intelligence systems. This article explores the future of software-defined vehicles and increasing levels of autonomy.

IDTechEx Technology Analyst Noah El Alami explores quantum sensors, which offer extreme precision in measuring time, gravity, magnetism, and more.

IDTechEx's Autonomous Vehicle Software Market report provides a holistic overview of the current cutting edge of autonomous driving sensors, introducing hardware and regulations before moving on to different approaches to software for ADAS and autonomous driving. It analyses key developments from players such as Waymo and Tesla, and also enabling technologies such as HD maps, steer-by-wire, and the applications of AI for software and software development. The report includes a 20-year forecast of the automotive software industry, separated by region and SAE level, forecasted in US$ and annual unit sales.

Webinar: Thermal Challenges and Cooling Strategies for Next-Gen 3D Semiconductor Packaging Presenter: Yulin Wang Date: 29 July 2025

Quantum computing promises a revolution in computational capabilities. This accessible quantum computing market report evaluates key technologies, companies, drivers for growth and adoption barriers across this emerging industry. Multiple competing quantum computer technologies are assessed: superconducting, silicon-spin, photonic, trapped ion, neutral atom, topological, diamond defect, and annealing. Detailed SWOT analysis, company roadmaps, and benchmarking are provided for each modality, along with twenty-year market forecast outlining the prospects of each.

In this article, IDTechEx explores the power and thermal challenges associated with 3D-stacked chips, as well as the emerging solution trends the industry is adopting or proposing for both 2.5D and 3D packaging technologies. The insights are based on IDTechEx's latest report, "Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities", which offers a comprehensive analysis of thermal management strategies for advanced semiconductor packaging technologies.

How AI transforms materials discovery: Why data quality, lab digitization, and inverse design are critical for next-gen alloys, batteries, and beyond - this article offers key insights from industry leaders.

With the increasing demand for semiconductors and data centers as memory and storage applications grow, there is a need for increased sustainability efforts. This article explores various approaches to reducing energy and emissions in semiconductor manufacturing processes and data centers.

Could MEMS gravimeters be the next breakthrough in the MEMS industry? Gravimeters unlock subsurface scanning by measuring tiny deviations in local gravitational fields. Current gravimeters are large and expensive, but IDTechEx's latest report, "Next-Generation MEMS 2026-2036: Markets, Technologies, and Players", reveals that microelectromechanical systems (MEMS) could bring chip-scale gravimeters to market and dramatically alter the field of gravimetry.

The automotive industry is undergoing a foundational shift toward software-defined vehicles (SDVs), where functionality, value, and user experience are increasingly governed by software rather than hardware. IDTechEx's new market report, "Software-Defined Vehicles, Connected Cars, and AI in Cars 2026-2036: Markets, Trends, and Forecasts", offers a comprehensive analysis of this transformation, covering the evolution of in-vehicle electrical/electronic (E/E) architecture, connectivity platforms, feature monetization models, and long-term market forecasts.

IDTechEx explores the rising hardware and energy requirements needed for training today's largest AI models, and how nations are competing to stay ahead. This article discusses the sanctions the US has imposed on China, and how China is navigating these.

Webinar: The Future of MEMS Gyroscopes Presenter: Mika Takahashi, Technology Analyst, IDTechEx Date: Thursday 24th July 2025 Choose your preferred time zone - the webinar runs three times during the day.

There is an increasing need for efficient and scalable storage, necessary to keep up with the increasing demands of data storage that is becoming more prevalent each year. This article covers developments and demand for data centers, AI, and edge computing.

The new market report "Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities" provides critical market intelligence on the power and thermal management challenges of advanced semiconductor packaging (2.5D and 3D), novel thermal materials, and the trend of liquid cooling solutions.