Webinar: Thermal Challenges and Cooling Strategies for Next-Gen 3D Semiconductor Packaging Presenter: Yulin Wang Date: 29 July 2025

Quantum computing promises a revolution in computational capabilities. This accessible quantum computing market report evaluates key technologies, companies, drivers for growth and adoption barriers across this emerging industry. Multiple competing quantum computer technologies are assessed: superconducting, silicon-spin, photonic, trapped ion, neutral atom, topological, diamond defect, and annealing. Detailed SWOT analysis, company roadmaps, and benchmarking are provided for each modality, along with twenty-year market forecast outlining the prospects of each.

In this article, IDTechEx explores the power and thermal challenges associated with 3D-stacked chips, as well as the emerging solution trends the industry is adopting or proposing for both 2.5D and 3D packaging technologies. The insights are based on IDTechEx's latest report, "Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities", which offers a comprehensive analysis of thermal management strategies for advanced semiconductor packaging technologies.

How AI transforms materials discovery: Why data quality, lab digitization, and inverse design are critical for next-gen alloys, batteries, and beyond - this article offers key insights from industry leaders.

With the increasing demand for semiconductors and data centers as memory and storage applications grow, there is a need for increased sustainability efforts. This article explores various approaches to reducing energy and emissions in semiconductor manufacturing processes and data centers.

Could MEMS gravimeters be the next breakthrough in the MEMS industry? Gravimeters unlock subsurface scanning by measuring tiny deviations in local gravitational fields. Current gravimeters are large and expensive, but IDTechEx's latest report, "Next-Generation MEMS 2026-2036: Markets, Technologies, and Players", reveals that microelectromechanical systems (MEMS) could bring chip-scale gravimeters to market and dramatically alter the field of gravimetry.

The automotive industry is undergoing a foundational shift toward software-defined vehicles (SDVs), where functionality, value, and user experience are increasingly governed by software rather than hardware. IDTechEx's new market report, "Software-Defined Vehicles, Connected Cars, and AI in Cars 2026-2036: Markets, Trends, and Forecasts", offers a comprehensive analysis of this transformation, covering the evolution of in-vehicle electrical/electronic (E/E) architecture, connectivity platforms, feature monetization models, and long-term market forecasts.

IDTechEx explores the rising hardware and energy requirements needed for training today's largest AI models, and how nations are competing to stay ahead. This article discusses the sanctions the US has imposed on China, and how China is navigating these.

Webinar: The Future of MEMS Gyroscopes Presenter: Mika Takahashi, Technology Analyst, IDTechEx Date: Thursday 24th July 2025 Choose your preferred time zone - the webinar runs three times during the day.

There is an increasing need for efficient and scalable storage, necessary to keep up with the increasing demands of data storage that is becoming more prevalent each year. This article covers developments and demand for data centers, AI, and edge computing.

The new market report "Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities" provides critical market intelligence on the power and thermal management challenges of advanced semiconductor packaging (2.5D and 3D), novel thermal materials, and the trend of liquid cooling solutions.

Collaborative robots (cobots), driven by AI, machine vision, and modular designs, are revolutionizing smart factories by enhancing human-robot collaboration, achieving 95%+ accuracy in tasks, and targeting a US$29.8 billion market by 2035.

This US$15 billion industry has grown and reached maturity in many sectors, but what are the technologies on the horizon that could be the next big leap forward for MEMS? This brand-new report by IDTechEx focuses on the cutting-edge next-generation MEMS technologies that are preparing to disrupt the industry, highlighting 3 key areas

At IDTechEx, we closely track the global semiconductor and computing landscape, spanning advanced silicon nodes, HPC (High Performance Computing) hardware, AI, advanced semiconductor packaging, photonics, and quantum computing. This article examines how geopolitical tensions are redirecting global investments in advanced semiconductor technologies, reshaping the semiconductor supply chain in pursuit of technological sovereignty.

Smart glasses could create real life subtitles for clearer interactions, while helmets for firefighters or policemen with sensing technology could make high-risk jobs safer. This article explores a future of accessible technologies to bring ease to daily life.

IDTechEx explores the impact of the US$1 billion acquisition in the quantum computing industry, where two major computing companies, IonQ and Oxford Ionics, have recently signed a deal.

Emerging non-volatile memory technologies are finding commercial traction not by replacing DRAM or NAND, but by solving real scaling and performance challenges in embedded systems. IDTechEx explores how MRAM, ReRAM, and others are becoming key enablers for next-generation automotive, IoT, and AI edge devices.

Webinar: Unlock the Future of Materials R&D: How Materials Informatics is Revolutionizing Innovation Date: Wednesday 11 June 2025 Approximately 30 minutes Multiple sessions available

Thursday 5 June 2025 - AI Chips: Energy Consumption Concerns of Large AI Models, GPU Technologies, and the Shift to Custom Silicon; Demand and concerns about large AI models; Current trends in high-performance GPUs; Shift towards cloud service providers (CSPs) using custom silicon in AI data centers; Insights into IDTechEx's 10-year forecasts for the AI Chips market