Emerging non-volatile memory technologies are finding commercial traction not by replacing DRAM or NAND, but by solving real scaling and performance challenges in embedded systems. IDTechEx explores how MRAM, ReRAM, and others are becoming key enablers for next-generation automotive, IoT, and AI edge devices.

Webinar: Unlock the Future of Materials R&D: How Materials Informatics is Revolutionizing Innovation Date: Wednesday 11 June 2025 Approximately 30 minutes Multiple sessions available

Thursday 5 June 2025 - AI Chips: Energy Consumption Concerns of Large AI Models, GPU Technologies, and the Shift to Custom Silicon; Demand and concerns about large AI models; Current trends in high-performance GPUs; Shift towards cloud service providers (CSPs) using custom silicon in AI data centers; Insights into IDTechEx's 10-year forecasts for the AI Chips market

Materials informatics is reshaping the landscape of materials research and development, bringing the full power of the data revolution to science and engineering. By leveraging AI, machine learning, and advanced analytics, materials informatics is accelerating discovery, streamlining development, and opening entirely new pathways for innovation.

IDTechEx explores the AI chip markets and key technologies seen in today's AI data centers. This article unveils key trends in high-performance GPUs, custom AI ASICs, and emerging AI chip markets.

Wednesday 21 May 2025 - Next-Gen Storage and Emerging Memory: How QLC SSDs and Emerging NVMs Are Changing the Game; Industry trends driving demand for high-capacity storage and non-volatile memory innovation; What QLC SSDs and HDDs are, and how they compare across key metrics such as performance, efficiency, and density; Market analysis: key players, product evolution, and technology scaling; Deep dive into emerging memory technologies: MRAM, ReRAM, PCM, and FeRAM; Benefits and challenges of emerging memory in embedded applications; Real-world use cases across AI, automotive, industrial IoT, and consumer devices; Future outlook and forecast highlights from the IDTechEx report

AI system architectures could surpass the capabilities of Chat GPT in high-end data centers, especially as communication between GPUs becomes more enhanced as a result of better connectivity.

AI and machine learning methods can be used across a battery's entire life, from material discovery and cell testing to second-life assessment, to enhance new developments and diagnostic capabilities.

Tuesday 13 May 2025 - Are Metal-Organic Frameworks (MOFs) Ready for Large Scale Commercialization?; An overview of emerging MOF-based technologies approaching commercialization; Material choices and considerations for MOFs in key applications, such as carbon capture and water harvesting; Scaling MOF production for industrial applications; Market status and outlook for MOF demand based on IDTechEx forecasts

The rise of QLC SSDs is challenging hard disk drives in cold storage and beyond. IDTechEx explores how performance, density, and cost are shifting the economics of data storage.

The ability of PICs to precisely manipulate light at the chip level opens the door to various cutting-edge fields beyond data communication, including sensing, LiDAR, quantum computing, and high-performance computing (HPC).While PIC-based transceivers are set to dominate the market, with long-range transceivers for 5G/6G networks forming the second largest sector of the overall market, other applications for PIC are growing steadily.

Conventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.

At GTC 2025, NVIDIA announced two new networking switch platforms - Spectrum-X Photonics and Quantum-X Photonics - based on Co-Packaged Optics (CPO) technology. Both platforms incorporate TSMC's 3D hybrid bonding technology for its CPO, and these will be the world's first 3D-stacked silicon photonics engine.

With the introduction of collaborative robots and AI agents, household chores could also become a display of the latest intelligent robotics technology. From companionship robots that engage in conversation and play board games to cars that drive themselves safely using radar and artificial intelligence, the possibilities for robotics are endless.

In this article, IDTechEx explores how semiconductor manufacturing holds the key to enabling the low-cost mass production of quantum sensors.

IDTechEx analysts attended Data Centre World in London as part of ongoing data center sustainability and thermal management research. This article highlights three insights from the event.

Front and side radars serve distinct yet complementary roles in ADAS, making them essential for autonomous vehicles. IDTechEx explores the latest radar developments and explores autonomy leveling up, with Level 2+ asserting itself within the US and Europe's autonomous vehicle markets.

Parallel computer architectures, such as those deployed for modern high-performance computing (HPC) and artificial intelligence (AI) workloads, frequently encounter memory bottlenecks that limit performance, known as the 'memory wall'. IDTechEx assesses the key developments and trends in memory and storage technologies, including high-bandwidth memory (HBM), DDR, NAND, and many more.

Quantum sensors get their name from their ability to measure on a quantum scale the smallest known parts of the universe, including atoms and other tiny particles, some of which were unknown before the introduction of this technology. IDTechEx's report, "Quantum Sensors Market 2025-2045: Technology, Trends, Players, Forecasts" provides an in-depth analysis of the technology by type and application, forecasting the quantum sensor market to reach US$2.2 billion in 2045, with a compound annual growth rate of 11.4%.