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The world of vehicle autonomy is made possible with intelligent sensing and radar capabilities that can improve the safety of cars and make for smoother journeys. This article covers the various components of autonomous vehicles, including in-cabin sensing, software and the integration of AI, and radar technology.

In this brief video IDTechEx analyst Matthew Fall assesses Silicon Carbide (SiC) and Gallium Nitride (GaN) semiconductor materials, which are used for power electronics in data centers, renewables and electric vehicles.

Helium is a finite resource and critical for several applications, including semiconductor manufacturing. With Qatar producing a third of the world's helium supply, geopolitical tensions in the Middle East has created a major supply chain bottleneck for industries critically reliant on helium. This article from IDTechEx looks at the critical role of helium in the semiconductor industry, Qatar's position in the helium supply chain, and what this…

Join IDTechEx Technology Analyst Shihao Fu on Thursday 30th April for the expert-led webinar, "Humanoid Robots in Industry: Market Readiness, ROI, and 10-Year Outlook". Choose your preferred time zone - the webinar runs three times in one day.

IDTechEx forecasts the power electronics market to exceed US$65 billion by 2036, with EVs and data center power electronics taking up significant market share. Across the power electronics industry, the commercialization of wide bandgap semiconductors SiC and GaN enable increased efficiency and power density. The demands of the EV, data center, and renewables industries differ significantly, resulting in different rates of technological…

Join IDTechEx Senior Technology Analyst Mika Takahashi on Thursday 23rd April for the expert-led webinar, "Photonic Integrated Circuits, Driving an Interconnect Revolution". Choose your preferred time zone - the webinar runs three times in one day.

As economies worldwide are growing exponentially, there is increasing pressure on many of the major sectors to keep up with global trends. This article covers the need for new thermal management technologies alongside the growing demand for vehicle electrification high performance computing.

Modern AI and high-performance computing workloads require tremendous amounts of information to be transmitted at enormous speeds between chips, servers, and racks. Traditionally, this has been done with copper wiring over longer distances, but the current generation of architectures has been pushing the physical limits of what copper can achieve, and the industry has been facing a so-called 'interconnect bottleneck'. Photonic integrated circuits…

IDTechEx's latest report, titled "Silicon Photonics and Photonic Integrated Circuits 2026-2036: Technologies, Markets, and Forecasts", offers an in-depth assessment of the latest advancements in PIC technologies. The report comprehensively analyses the key technologies and components including modulators, light sources, waveguides, and material platforms for photonics, as well as assessing the supply chain, market dynamics, and end-use applications.

The emergence of 5G and 6G telecommunications, along with the rise of data center demand and advanced automotive radar systems, is presenting a need for low-loss materials to optimize transmission. This article explores how low-loss materials can prevent transmission losses associated with higher sensitivities and frequencies.