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Deep diving into the smallest possible phenomena of the universe and solving the world's most difficult and incomprehensible problems is the work of quantum technology. This article covers quantum sensors and computing.

As the AI boom accelerates, unanswered questions remain around how to build more data centers sustainably. In this article, IDTechEx explores the crucial role of low-carbon power, energy efficiency, and reducing supply chain emissions.

Artificial intelligence having a physical body and fields being tended to from the sky are two phenomena that could be enabled by developments within the robotics sector. This article explores developments across humanoids and drones.

With data centers being one of the largest contributors to global emissions and high energy usage, they are gaining attention, with regulations and renewable energy options becoming increasingly discussed within the sector. This article covers details across the data center ecosystem, including sustainability movements and battery storage.

Materials informatics is transforming modern materials R&D, accelerating the discovery and development of new materials while expanding what can be achieved through artificial intelligence. This article explores three applications driving the field today: AI-assisted screening, formulation development and generative design.

The world of computing is growing in line with increasing demands for problem solving and robotic integration across many major sectors. Quantum computing, semiconductor technologies, and the rise of humanoid robots are some examples of how diverse computing technologies can be.

Silicon, silicon carbide, gallium nitride, and ultra-wide bandgap (UWBG) semiconductors all compete for space in the power electronics market. While data centers drive further commercialization of wide bandgap semiconductors to support increasingly power-hungry servers, other industries such as wind energy are reluctant to switch to newer, less proven technologies. At the same time, UWBG R&D continues to push these materials closer to…

As semiconductor packaging technologies evolve, 2.5D packaging and 3D Cu-Cu hybrid bonding are becoming essential routes to higher performance and improved power efficiency. However, manufacturing these packages at high yield requires careful material selection, process control, and continued innovation in packaging manufacturing techniques.

Advanced semiconductor packaging has become a central technology platform for high performance computing. For AI and HPC processors, performance depends not only on transistor density, but also on memory bandwidth, I/O density, power delivery, thermal management, and the ability to integrate more functional dies within a single package. This article explores the technology development trends in advanced semiconductor packaging technologies.

In this article, IDTechEx analyzes the potential of nuclear small modular reactors (SMRs) to satisfy the growing power demand of AI data centers. Tech hyperscalers like Amazon, Google, and Meta are already making investments in SMR startups, with IDTechEx forecasting the global SMR market to reach US$53.8 billion in 2036 and almost US$300 billion by 2046.