Webinar: Thermal Challenges and Cooling Strategies for Next-Gen 3D Semiconductor Packaging
Presenter: Yulin Wang, Senior Technology Analyst, IDTechEx
Date: Tuesday 29 July 2025
Choose your preferred time zone - the webinar runs three times during the day. View times and register here.
Can't attend live? Register anyway to receive the on-demand recording and presentation slides, available for a limited time.
With the increasing demand in computation and low latency, the semiconductor industry is transitioning from 2.5D packaging (e.g., B200 and MI350) to next-generation 3D packaging architecture. However, 3D semiconductor packaging faces unprecedented challenges such as IR drop in the power delivery network, thermal coupling of vertically stacked dies, and complexities of fabricating many through-silicon-vias (TSVs). In order to mitigate these challenges to accelerate the adoption of 3D semiconductor packaging, the industry is exploring a variety of approaches, such as using high-performance TIMs (e.g., graphene, liquid metal, etc.) to enhance heat transfer and introducing liquid-cooled microchannels inside packaging (also known as microfluidic cooling).
The webinar will discuss:
- What are MEMS
- Inertial Measurement Units
- IMU Market Overview
- Hemispherical and micro Hemispherical resonator gyroscopes, functionality and manufacturing options
- MEMS Speakers/gravimeters, report overview
The insights shared are drawn from IDTechEx's new report, "Thermal Management for Advanced Semiconductor Packaging: Technologies, Markets, and Opportunities 2026-2036".
Date: Tuesday 29 July 2025
Duration: Approx. 30 Minutes
We will be holding exactly the same webinar three times in one day. Please register for the session most convenient for you.