Semiconductors

Join Senior Technology Analyst Mika Takahashi on Thursday 27th November for a new webinar sharing insights on what the telecoms industry should learn from the 5G rollout, to ensure 6G is a success from day one. Choose your preferred time zone - the webinar runs three times during the day.

The need for sustainability within computing has never been so prevalent, with artificial intelligence, large language models, and high-performance computing requiring energy intensive processes that are contributing to increased carbon emissions. This article explores sustainability trends within the sector.

Join IDTechEx critical materials expert Dr Jack Howley on Thursday 6th November for the webinar 'Critical Material Recovery from Waste: Trends, Technologies, and 20-Year Growth Outlook'. Choose your preferred time zone - the webinar runs three times during the day.

Thermal management technologies are an integral part of systems within a number of sectors, ensuring optimized performance and safety. This article covers some of the thermal management techniques used in data centers and semiconductors.

The increase in demand for high performance computing is resulting in the need for enhanced semiconductor performance, of which thermal management is a large component. This article covers some of the latest developments and favored materials involved in thermal management for advanced semiconductor packaging.

Semiconductors, co-packaged optics, and photonic integrated circuits are some of the research topics covered by IDTechEx showcasing the advancements being made in the semiconductor industry. This article explores some of the current trends and developments being made within the sector.

Helium is favored for cryogenic applications and temperatures close to absolute zero due to its chemical inertness. This article explores different approaches to sourcing helium and its uses in semiconductor manufacturing.

Webinar: Thermal Challenges and Cooling Strategies for Next-Gen 3D Semiconductor Packaging Presenter: Yulin Wang Date: 29 July 2025

In this article, IDTechEx explores the power and thermal challenges associated with 3D-stacked chips, as well as the emerging solution trends the industry is adopting or proposing for both 2.5D and 3D packaging technologies. The insights are based on IDTechEx's latest report, "Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities", which offers a comprehensive analysis of thermal management strategies for advanced semiconductor packaging technologies.

Front and side radars serve distinct yet complementary roles in ADAS, making them essential for autonomous vehicles. IDTechEx explores the latest radar developments and explores autonomy leveling up, with Level 2+ asserting itself within the US and Europe's autonomous vehicle markets.