Webinar: CPO (Co-Packaged Optics) Technologies and Market Outlook for Next-Gen AI Systems
Presenter: Dr Yu-Han Chang, Principal Technology Analyst, IDTechEx
Date: Thursday 15th January 2026
As data center architectures evolve, system architects are gravitating toward co-packaged optics (CPO), where tighter electrical-optical integration can fundamentally overcome the scaling limits of pluggable modules.
In this webinar, IDTechEx Principal Analyst Dr Yu-Han Chang will share independent, research-backed insights including:
- An overview of CPO technology and the implications for enhancing data center efficiency and shaping future network architecture.
- Semiconductor packaging breakthroughs: Insight into the latest advancements in semiconductor packaging, including 2.5D and 3D technologies, and their role in enabling CPO innovation.
- Outlook for the CPO market and its anticipated impact on the industry
This webinar draws on research from IDTechEx's latest report on the topic, 'Co-Packaged Optics (CPO) 2026-2036: Technologies, Market, and Forecasts', which reviews recent advances in CPO technology, tracks emerging packaging approaches, assesses the strategies of leading companies, and provides long-term market forecasts.