Artificial Intelligence Research
Sep 3, 2026
Breaking the Dimensional Barrier: From 2D to 3D Co-Packaged Optics
The 2025-2026 period has seen growing industry momentum behind 3D-stacked CPO network switches, with companies increasingly moving away from laterally placed architectures to accommodate AI data center scale-up. In this article, IDTechEx delves into the packaging advancements enabling this transition, and the technological barriers that face the key players driving it.