Semiconductors, Computing & AI

As radio frequency front ends extend into Ka band (about 26.5-40 GHz) and data center networks advance toward co packaged optics, engineered low loss glass substrates valued for high resistivity, dimensional stability, and compatibility with through glass via interconnects are emerging as an integration platform for antenna in package modules and optical electrical co design alike.

In this article, IDTechEx Technology Analyst Noah El Alami explores the leading candidates for early commercial use cases of quantum computers. Chemistry simulations, optimization, and cybersecurity all have potential, but what will be the "killer app"?

Join IDTechEx critical materials expert Dr Jack Howley on Thursday 6th November for the webinar 'Critical Material Recovery from Waste: Trends, Technologies, and 20-Year Growth Outlook'. Choose your preferred time zone - the webinar runs three times during the day.

Thermal management technologies are an integral part of systems within a number of sectors, ensuring optimized performance and safety. This article covers some of the thermal management techniques used in data centers and semiconductors.

The telecom industry deploys new generations of wireless communications roughly every 10 years, with 6G expected to enter commercial use around 2030. So what is 6G, why is it needed, and how does it offer to change the game after the somewhat lacklustre performance of its predecessor, 5G?

Growing export restrictions placed on defense-related rare earth materials from China at a time of multiple international conflicts underscores growing demand in the US and Europe to develop alternative supply. China's latest export restrictions on critical rare earth elements applies yet more pressure to what are already tightly controlled materials.

As of 2025, single-phase direct-to-chip (D2C) liquid cooling remains the dominant solution for high-end GPU thermal management. However, with thermal design power (TDP) continuing to rise, the industry is approaching the limits of what single-phase cooling can handle. Two-phase D2C cooling is expected to enter large-scale deployment around 2027.

The increase in demand for high performance computing is resulting in the need for enhanced semiconductor performance, of which thermal management is a large component. This article covers some of the latest developments and favored materials involved in thermal management for advanced semiconductor packaging.

The renewable energy sector is becoming increasingly enriched with the developments of clean, green, and natural power sources, with hydrogen and solar being two of the biggest technology names rising within the industry. This article covers some of their latest applications including solar canopy charging, stationary fuel cells, and hydrogen planes.

Glass interposers and glass core substrates are being pursued intensively by leading device makers, materials suppliers, and equipment vendors for advanced packaging applications, as discussed in IDTechEx's brand new report "Glass in Semiconductors 2026-2036: Applications, Emerging Technologies, and Market Insights".