Semiconductors

Advanced semiconductor packaging is experiencing significant growth due to the interplay of technological, economic, and market forces. As silicon scaling approaches its limits, advanced packaging offers a viable alternative for boosting chip performance, particularly for high-performance computing (HPC) applications like AI and data centers, which demand increased computational power and bandwidth.

Friday 8 November 2024 - An outline of the ongoing development of specialized AI accelerators and the impact of ARM architectures on the CPU market for HPC; Trends and developments in memory and storage technologies for AI and HPC workloads and the advanced semiconductor packaging technologies to realize next-generation solutions; Examination of the growing role of silicon photonics in high-speed interconnects for HPC and how co-packaged optics will increase bandwidths whilst reducing power consumption; Discussion of the push towards liquid cooling in data centers, driven by increasing AI workloads; Insights from IDTechEx's ten-year forecasting for the HPC market

Wednesday 30 October 2024 - Data Center Liquid Cooling - 6-Fold Market Size Expansion in 10 Years; Air cooling overview; Direct-to-chip cooling: An exploration of technical barriers and advantages of single- and two-phase D2C cooling; Immersion cooling: An examination of single-phase and two-phase immersion and their technical and commercial barriers; Coolant comparison and regulations: A comparative analysis of coolants used in liquid cooling systems, including costs, regulatory requirements and operating temperature; Data center cooling value chain and liquid cooling on the data center facility level; Cost analysis of data center cooling; Thermal interface materials: An overview of the critical TIMs in efficient heat transfer within cooling systems; Market size forecast and future opportunities

The global commercialization of autonomous trucks in 2024 is being shaped significantly by regional regulations and government policies. To enable the growth of autonomous trucking, the U.S., Europe and China have adopted different approaches, primarily influenced by their respective regulatory environments, infrastructure development, and governmental support.

The rapid rise of AI and HPC (high performing computing) applications is driving a fundamental shift in data center cooling strategies. As chips like Nvidia's B200 and Intel's Falcon Shores GPU push the limits of thermal design power, direct-to-chip and immersion cooling solutions are becoming critical to managing the heat loads in modern data centers.

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", goes into detail about emerging technologies, including 2.5D and 3D packaging.

End-of-life equipment from automotives, electric vehicles, e-waste and decarbonized energy technologies are rapidly emerging secondary raw material sources for valuable critical materials. A new report from IDTechEx forecasts that US$110B of critical materials will be recovered annually from secondary sources by 2045, with a combined weight of over 3.3 million tonnes.

Photonic Integrated Circuits are photonic circuits formed on a semiconductor material that allows light to pass through it, such as silicon dioxide, also known as Silica (or Glass). These photonic circuits contain components for manipulating light passing through the circuit, enabling functionalities such as data transmission, sensing, and processing within a compact form factor. PICs are fundamentally altering how we manage and utilize optical signals, paving the way for advancements across multiple industries.

IDTechEx announces the availability of a new report, "Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts". This new report looks at key market players, emerging materials and technologies, and new applications. Granular 10-year market forecasts are also included.

IDTechEx announces the availability of a new report, "Metal-Organic Frameworks (MOFs) 2024-2034: Market, Technology, and Players". This comprehensive market report offers an independent analysis of metal-organic frameworks trends and considers applications of MOFs for carbon capture, water harvesting, chemical separation and purification, and several other early-stage technologies.