6G

Smart devices, autonomous driving, remote patient monitoring - countless new applications are being unlocked by advancements in telecommunication technology, specifically the transition to 5G. 5G telecommunications introduces two new frequency bands: sub-6 GHz (3.5 - 7 GHz) and mmWave (24 - 71 GHz).

IDTechEx have launched a new monthly podcast, 'Tomorrow's Tech by IDTechEx', bringing you up to date technology trends. In each episode our host will interview an industry expert from IDTechEx, offering insights into a range of emerging technologies.

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.

Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologies

Connected and Software-Defined vehicles (SDVs) represent a new paradigm for automakers and consumers. Whereas older ICE vehicles were a conglomeration of 70+ Electronic Control units, kilometers of wiring, and many thousands of components, the new era of vehicles can be more centralized, connected, and convenient, bringing benefits to both the consumer and OEM.

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.

Every decade, a new telecom generation emerges, with 5G currently being commercialized, offering faster data rates, low latency, and enhanced reliability. 6G is characterized by Tbps data rates, microsecond latency, and extensive network dependability.

Friday 24 November 2023 - Advanced Semiconductor Packaging: Materials, Technology, Market Outlook - Advanced semiconductor packaging markets and their mid-long-term opportunity; Player analysis - the dynamics of advanced semiconductor packaging battleground; Industry barriers: Manufacturing challenges and material requirements; Research direction for Advanced Semiconductor Packaging

Friday 10 November 2023 - Summary of 5G Progress: An overview of 5G commercial advancements in the past year, along with future growth prospects; 6G Tech Trends: Insights into the key technology trends in 6G development, identification of key contributors, and the overarching goals; 6G Networks Enablers: Understanding how non-terrestrial network and a smart electromagnetic (EM) environment through technologies like smart skins, repeaters, and reconfigurable intelligent surfaces (RIS) can contribute to 6G network deployment; Applications in 5G and Future 6G: Examination of the current state of 5G adoption across industries and a glimpse into the potential applications that 6G will address in the future.

As reported by Nvidia's Q2 financial statement, its second-quarter data center's revenue was a record US$10.32 billion, up 141% from the previous quarter and up 171% from a year ago. With the increasing demand for high-performance servers in data centers, IDTechEx has seen challenges in data center thermal management and tremendous opportunities in this industry.