https://www.onartificialintelligence.com/tag/228/6g IDTechEx provides independent analysis on the development and application of RFID, Printed Electronics, Photovoltaics and Energy Harvesting en Copyright (C) IDTechEx Ltd The emergence of 5G and 6G telecommunications, along with the rise of data center demand and advanced automotive radar systems, is presenting a need for low-loss materials to optimize transmission. This article explores how low-loss materials can prevent transmission losses associated with higher sensitivities and frequencies.https://www.idtechex.com/en/research-article/optimizing-signal-for-communication-and-radar-with-low-loss-materials/34537?rsst2id=228https://www.idtechex.com/en/research-article/optimizing-signal-for-communication-and-radar-with-low-loss-materials/34537?rsst2id=228Wed, 01 Apr 2026 ZZZl.schuett@idtechex.com (Lily-Rose Schuett) In October 2025, Virgin Media (one of the UK's largest telecom operators) signed a landmark partnership with Starlink to provide D2C (direct-to-cell) mobile services from 2026. Although this technology will harness the same satellites as those used for Starlink's satellite Wi-Fi, IDTechEx's latest report on 6G unpacks how D2C mobile services face fundamental physical challenges that will affect their performance compared with satellite Wi-Fi.https://www.idtechex.com/en/research-article/why-virgin-medias-direct-to-cell-wont-deliver-broadband-anytime-soon/34113?rsst2id=228https://www.idtechex.com/en/research-article/why-virgin-medias-direct-to-cell-wont-deliver-broadband-anytime-soon/34113?rsst2id=228Fri, 28 Nov 2025 ZZZm.takahashi@idtechex.com (Mika Takahashi) High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", goes into detail about emerging technologies, including 2.5D and 3D packaging.https://www.idtechex.com/en/research-article/2-5d-and-3d-idtechex-explores-advanced-semiconductor-packaging/31643?rsst2id=228https://www.idtechex.com/en/research-article/2-5d-and-3d-idtechex-explores-advanced-semiconductor-packaging/31643?rsst2id=228Fri, 30 Aug 2024 ZZZl.schuett@idtechex.com (Lily-Rose Schuett) Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.https://www.idtechex.com/en/research-article/role-of-3d-cu-cu-hybrid-bonding-in-powering-future-hpc-and-ai-products/30902?rsst2id=228https://www.idtechex.com/en/research-article/role-of-3d-cu-cu-hybrid-bonding-in-powering-future-hpc-and-ai-products/30902?rsst2id=228Thu, 18 Apr 2024 ZZZy.chang@idtechex.com (Dr Yu-Han Chang) Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.https://www.idtechex.com/en/research-article/aip-market-dynamics-drivers-and-challenges-in-5g-and-6g/30777?rsst2id=228https://www.idtechex.com/en/research-article/aip-market-dynamics-drivers-and-challenges-in-5g-and-6g/30777?rsst2id=228Wed, 03 Apr 2024 ZZZy.chang@idtechex.com (Dr Yu-Han Chang) Thursday 14 March 2024 - Exploring Antenna Packaging Technologies: From 5G mmWave to 6G; An overview of antenna packaging technologies for high frequency telecommunication; Antenna packaging strategies for mmWave; Antenna packaging strategies for 6G (beyond 100 GHz)https://www.idtechex.com/en/research-article/upcoming-webinar-exploring-antenna-packaging-technologies/30622?rsst2id=228https://www.idtechex.com/en/research-article/upcoming-webinar-exploring-antenna-packaging-technologies/30622?rsst2id=228Wed, 06 Mar 2024 ZZZl.rogers@idtechex.com (Lucy Rogers) As the world awaits the full take-off of the next generation of telecommunication technologies, 5G, important stakeholders are preparing for the future of future telecommunications - 6G. This may seem premature, given that deployment of 5G infrastructure and base stations are not nearly at their peak yet.https://www.idtechex.com/en/research-article/road-to-6g-the-emerging-low-loss-materials-enabling-future-telecoms/30639?rsst2id=228https://www.idtechex.com/en/research-article/road-to-6g-the-emerging-low-loss-materials-enabling-future-telecoms/30639?rsst2id=228Mon, 04 Mar 2024 ZZZs.dadhania@idtechex.com (Sona Dadhania) Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.https://www.idtechex.com/en/research-article/advancing-integration-in-antenna-packaging-technologies-for-5g-and-6g/30627?rsst2id=228https://www.idtechex.com/en/research-article/advancing-integration-in-antenna-packaging-technologies-for-5g-and-6g/30627?rsst2id=228Tue, 27 Feb 2024 ZZZy.chang@idtechex.com (Dr Yu-Han Chang) Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.https://www.idtechex.com/en/research-article/advanced-semiconductor-packaging-trends-in-ai-and-hpc/30601?rsst2id=228https://www.idtechex.com/en/research-article/advanced-semiconductor-packaging-trends-in-ai-and-hpc/30601?rsst2id=228Fri, 23 Feb 2024 ZZZy.chang@idtechex.com (Dr Yu-Han Chang) Thursday 15 February 2024 - The Upwards Trajectory of Low-Loss Materials for Future Telecommunications - Identify key factors in 5G deployment affecting demand for low-loss materials; Consider important types of low-loss materials for 5G; Explore trends influencing the development of low-loss materials for 6G; Present IDTechEx's market outlook for the industryhttps://www.idtechex.com/en/research-article/upcoming-webinar-the-upwards-trajectory-of-low-loss-materials/30561?rsst2id=228https://www.idtechex.com/en/research-article/upcoming-webinar-the-upwards-trajectory-of-low-loss-materials/30561?rsst2id=228Mon, 12 Feb 2024 ZZZl.rogers@idtechex.com (Lucy Rogers) Smart devices, autonomous driving, remote patient monitoring - countless new applications are being unlocked by advancements in telecommunication technology, specifically the transition to 5G. 5G telecommunications introduces two new frequency bands: sub-6 GHz (3.5 - 7 GHz) and mmWave (24 - 71 GHz).https://www.idtechex.com/en/research-article/mmwave-5g-to-drive-low-loss-materials-to-surpass-us-2-1b-by-2034/30542?rsst2id=228https://www.idtechex.com/en/research-article/mmwave-5g-to-drive-low-loss-materials-to-surpass-us-2-1b-by-2034/30542?rsst2id=228Mon, 05 Feb 2024 ZZZs.dadhania@idtechex.com (Sona Dadhania) IDTechEx have launched a new monthly podcast, 'Tomorrow's Tech by IDTechEx', bringing you up to date technology trends. In each episode our host will interview an industry expert from IDTechEx, offering insights into a range of emerging technologies.https://www.idtechex.com/en/research-article/brand-new-podcast-tomorrows-tech-by-idtechex/30430?rsst2id=228https://www.idtechex.com/en/research-article/brand-new-podcast-tomorrows-tech-by-idtechex/30430?rsst2id=228Tue, 16 Jan 2024 ZZZc.martin@idtechex.com (Charlotte Martin) Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.https://www.idtechex.com/en/research-article/advanced-semiconductor-packaging-technology-trends-2-5d-and-3d-insights/30403?rsst2id=228https://www.idtechex.com/en/research-article/advanced-semiconductor-packaging-technology-trends-2-5d-and-3d-insights/30403?rsst2id=228Wed, 10 Jan 2024 ZZZy.chang@idtechex.com (Dr Yu-Han Chang) Wednesday 17 January 2024 - 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis; Market outlook for 2.5D and 3D packaging technologieshttps://www.idtechex.com/en/research-article/webinar-advancement-in-2-5d-and-3d-semiconductor-packaging-technologies/30371?rsst2id=228https://www.idtechex.com/en/research-article/webinar-advancement-in-2-5d-and-3d-semiconductor-packaging-technologies/30371?rsst2id=228Tue, 09 Jan 2024 ZZZl.rogers@idtechex.com (Lucy Rogers) Connected and Software-Defined vehicles (SDVs) represent a new paradigm for automakers and consumers. Whereas older ICE vehicles were a conglomeration of 70+ Electronic Control units, kilometers of wiring, and many thousands of components, the new era of vehicles can be more centralized, connected, and convenient, bringing benefits to both the consumer and OEM.https://www.idtechex.com/en/research-article/software-defined-vehicles-set-to-be-worth-over-us-700bn-by-2034/30391?rsst2id=228https://www.idtechex.com/en/research-article/software-defined-vehicles-set-to-be-worth-over-us-700bn-by-2034/30391?rsst2id=228Mon, 08 Jan 2024 ZZZj.falkiner@idtechex.com (James Falkiner)