PIC transceivers are fast-becoming essential tools in the AI revolution, where they speed up connections between nodes in data centers whilst reducing power consumption, allowing larger AI models to be trained and executed. However, unlike purely electrical integrated circuits, PICs require the integration of a III-V semiconductor to function as the laser because silicon does not lase. As of 2026 the dominant material choice is Indium Phosphide (InP).

In this video IDTechEx explores the megatrends for more sustainable data centers.

Thermal management strategies are the underdogs of modern technologies, reducing the risks of overheating in cases where exponentially increasing demand for power can lead to component temperatures rising.

The 2025-2026 period has seen growing industry momentum behind 3D-stacked CPO network switches, with companies increasingly moving away from laterally placed architectures to accommodate AI data center scale-up. In this article, IDTechEx delves into the packaging advancements enabling this transition, and the technological barriers that face the key players driving it.

The battery sector is rapidly growing in multiple directions, with battery storage technologies expected to be responsible for powering many major sectors including data centers and 6G power stations, and solid-state batteries gaining increasing amounts of attention for their safer chemistries.

With human-like arms and legs, humanoid robots have recently been taking advantage of their stature to compete in the World Humanoid Games in China beginning on Saturday. IDTechEx's research uncovers the technologies that make these robots move.

Sensing provides a means of understanding the world and realizing information that the human senses cannot detect. From wearables to quantum, IDTechEx's portfolio of research covers a whole array of sensing technologies and the latest developments within the markets.

Automotive interiors possess a new kind of intelligence, enabled by sensing technologies and advanced software. In-cabin sensing and autonomous driving software are two specific areas covered by IDTechEx in their research portfolio.

Deep diving into the smallest possible phenomena of the universe and solving the world's most difficult and incomprehensible problems is the work of quantum technology. This article covers quantum sensors and computing.

As the AI boom accelerates, unanswered questions remain around how to build more data centers sustainably. In this article, IDTechEx explores the crucial role of low-carbon power, energy efficiency, and reducing supply chain emissions.

Artificial intelligence having a physical body and fields being tended to from the sky are two phenomena that could be enabled by developments within the robotics sector. This article explores developments across humanoids and drones.

With data centers being one of the largest contributors to global emissions and high energy usage, they are gaining attention, with regulations and renewable energy options becoming increasingly discussed within the sector. This article covers details across the data center ecosystem, including sustainability movements and battery storage.

Materials informatics is transforming modern materials R&D, accelerating the discovery and development of new materials while expanding what can be achieved through artificial intelligence. This article explores three applications driving the field today: AI-assisted screening, formulation development and generative design.

The world of computing is growing in line with increasing demands for problem solving and robotic integration across many major sectors. Quantum computing, semiconductor technologies, and the rise of humanoid robots are some examples of how diverse computing technologies can be.

Silicon, silicon carbide, gallium nitride, and ultra-wide bandgap (UWBG) semiconductors all compete for space in the power electronics market. While data centers drive further commercialization of wide bandgap semiconductors to support increasingly power-hungry servers, other industries such as wind energy are reluctant to switch to newer, less proven technologies. At the same time, UWBG R&D continues to push these materials closer to commercialization, further complicating the power electronics industry's future.

As semiconductor packaging technologies evolve, 2.5D packaging and 3D Cu-Cu hybrid bonding are becoming essential routes to higher performance and improved power efficiency. However, manufacturing these packages at high yield requires careful material selection, process control, and continued innovation in packaging manufacturing techniques.

Advanced semiconductor packaging has become a central technology platform for high performance computing. For AI and HPC processors, performance depends not only on transistor density, but also on memory bandwidth, I/O density, power delivery, thermal management, and the ability to integrate more functional dies within a single package. This article explores the technology development trends in advanced semiconductor packaging technologies.

In this article, IDTechEx analyzes the potential of nuclear small modular reactors (SMRs) to satisfy the growing power demand of AI data centers. Tech hyperscalers like Amazon, Google, and Meta are already making investments in SMR startups, with IDTechEx forecasting the global SMR market to reach US$53.8 billion in 2036 and almost US$300 billion by 2046.

Robots take on a multitude of forms, each with technologies that make them best suited to their own specific environments, either working independently or in the company of humans. This article covers cobots, service robots, humanoids, drones, and in-vehicle AI assistants.

The transition to 800V in electric vehicles has accelerated the commercialization of wide bandgap semiconductors, and has led to increased vehicle range, faster charging, and greater e-powertrain efficiency. AI data centers are being pushed to ever-increasing power ratings to support future generations of AI training and inference. Drawing inspiration directly from EV power electronics, the data center industry is working to develop the HVDC (800VDC) data center, enabled by wide bandgap power electronics innovations.