Thursday 12 December 2024 - Machine Learning Methods for Battery Development, Manufacturing and Management; An introduction to challenges in the battery industry; An overview of machine learning and how it can be applied for batteries; Use-case analysis for five different market sectors Business model analysis for the overall market; Qualitative conclusions on how and where machine learning will see use over the next few years

Thursday 19 December 2024 - What is quantum computing, and what is the state of the industry?; How is the industry evolving as commercialisation ramps up?; How do scalability challenges vary between quantum computing modalities?; What are some key updates from major players in the eco-system from 2024?; Which trends can be expected in the quantum computing market in 2025 and beyond?

The development of autonomous buses and roboshuttles is likely to continue somewhat slowly due to a lack of funding and regulatory challenges. However, IDTechEx highlights the next stages of developments within their report, and with the already commercialized examples of autonomous city buses and minibusses, success in the industry is increasingly likely.

As the electric vehicle (EV) and battery energy storage system (BESS) industries grow, requirements for the batteries that power them become more demanding. To achieve more energy-dense batteries that aren't unsustainably expensive, faster battery development is needed, as well as more efficient management, manufacturing, and recycling methods. Artificial intelligence (AI) will play an important role in achieving these goals.

Utilizing alternatives to helium where possible could allow for a greater conservation of helium, which could prove to be necessary for the market going forward. IDTechEx reports that since 2005, there have been 4 supply shortages of helium, each resulting in high price volatility, with the price of helium having almost doubled since 2021.

Autonomous driving technologies have seemingly been on the horizon for the last decade, maybe more. Over the past four years, level 3 technologies have been certified for consumer use on public roads, hands-off/eyes-on driving has solidified as a market segment, and commercial driverless robotaxi services have become available to the public.

In this article, IDTechEx interrogates the state of the quantum technology market today, but then, crucially, how it is expected to evolve for growth across the next ten years.

Friday 22 November 2024 - Mobile Robotics: Emerging applications, challenges, innovative solutions, and the latest market developments; Service Robots: Different applications experience different growth rate; Collaborative Robots: Technologies and industrial news; Sensors for Robotics: An analysis of key sensors

Advanced semiconductor packaging is experiencing significant growth due to the interplay of technological, economic, and market forces. As silicon scaling approaches its limits, advanced packaging offers a viable alternative for boosting chip performance, particularly for high-performance computing (HPC) applications like AI and data centers, which demand increased computational power and bandwidth.

As Moore's Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density. Chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing.

As we look towards 2035, the demand for sensors is expected to grow significantly across various sectors, including automotive, industrial, healthcare, consumer electronics, and environmental monitoring. This article explores the key trends and innovations in sensor technology.

The evolution of telecommunications continues with each decade, and as 5G becomes widespread, attention is shifting to the next generation: 6G. Promising next-level capabilities compared to next generation, 6G will offer data rates reaching terabits per second (Tbps), microsecond-level latency, and ultra-high level of network reliability.

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex.

Friday 15 November 2024 - Background and context of quantum research and the transition to commercialization; Overview of the market landscape today, including key funding trends and the answers to 'why now'; The impact of meta-trends in cyber-security, energy security, and future mobility on the quantum market today, and a summary of motivations for commercial partnerships; Summary of key players in the exo-systems for quantum computing, quantum sensing, and quantum communications; Coverage of what is needed for market growth, alongside top-level market forecasts and CAGR predictions.

Friday 8 November 2024 - An outline of the ongoing development of specialized AI accelerators and the impact of ARM architectures on the CPU market for HPC; Trends and developments in memory and storage technologies for AI and HPC workloads and the advanced semiconductor packaging technologies to realize next-generation solutions; Examination of the growing role of silicon photonics in high-speed interconnects for HPC and how co-packaged optics will increase bandwidths whilst reducing power consumption; Discussion of the push towards liquid cooling in data centers, driven by increasing AI workloads; Insights from IDTechEx's ten-year forecasting for the HPC market

As of 2024, single-phase direct-to-chip (D2C) cooling dominates the high-end GPU thermal management market. However, with the increasing thermal design power (TDP), two-phase D2C cooling will be required.

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing. This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

Thursday 7 November 2024 - Which Technology Innovations Will Be Most Disruptive in the Global Sensor Market? An overview of meta-trends shaping the sensor market landscape; A summary of major market verticals, product types and leading technologies; Coverage of near-term trends in sensor technology development, adoption and integration - including the impact of AI on edge sensing; An overview of disruptive emerging sensor technologies recently commercialized, their value proposition, advantages and market challenges. This includes printed sensors, quantum sensors, emerging image sensors, biosensors, gas sensors and nanocarbon sensors; Case studies in fast growing markets for sensors technology, both established and emerging, such as future mobility, wearables and IoT (industrial, consumer and environmental); Initial ten-year forecasting insights and sensor market outlook for the next ten years

Thursday 14 November 2024 - Chiplet Technology: Revolutionizing Semiconductor Design and Integration; Definition and significance of chiplets in modern semiconductor design; Comparison with SoC and SiP technologies; Introduction to heterogeneous integration; Drivers and advantages of adopting chiplet technology; Brief overview of challenges in implementing chiplets; Insights into the future potential and impact of chiplet technology

While sensors contribute just a fraction of the annual revenue generated by major electronics companies, sensor technology nevertheless represents a multi-billion-dollar global market.