Semiconductors, Data Centers & AI

Thursday 12 September 2024 - How Is Critical Material Recovery Unlocking a Multi-Billion Dollar Market? Introduction to critical materials and key application markets; Critical material sources and why secondary material streams are rapidly emerging; Critical material recovery technology trends and their application in secondary sources; Valuable lessons to learn from established critical platinum group metal and semiconductor recovery; IDTechEx's outlook and conclusions on emerging critical material recovery markets and key growth opportunities.

End-of-life equipment from automotives, electric vehicles, e-waste and decarbonized energy technologies are rapidly emerging secondary raw material sources for valuable critical materials. A new report from IDTechEx forecasts that US$110B of critical materials will be recovered annually from secondary sources by 2045, with a combined weight of over 3.3 million tonnes.

Photonic Integrated Circuits are photonic circuits formed on a semiconductor material that allows light to pass through it, such as silicon dioxide, also known as Silica (or Glass). These photonic circuits contain components for manipulating light passing through the circuit, enabling functionalities such as data transmission, sensing, and processing within a compact form factor. PICs are fundamentally altering how we manage and utilize optical signals, paving the way for advancements across multiple industries.

Thursday 15 August 2024 - Co-Packaged Optics (CPO) Unveiled: Network Evolution, Packaging Innovation, and Market Trends. With data centers experiencing unprecedented demand for higher data throughput and improved power efficiency driven by the rise of AI, machine learning, and the proliferation of cloud-based services, there is an urgent need for innovative solutions to enhance network infrastructure. CPO is rapidly gaining traction as it promises to address the limitations posed by traditional pluggable optical modules.

With the ever-increasing need for heat dissipation, high-performance thermal interface materials with higher thermal conductivity and other properties are becoming essential. Driven by this trend, a number of high-performance TIMs are emerging. This article primarily introduces the advantages and drawbacks of advanced carbon-based TIMs. However, it is worth noting that many other TIMs offer superior performance.

Quantum technology exists in unsuspecting places, including cameras, computers, and smartphones. While quantum technology research has existed in various forms for over a hundred years, the 21st century saw an increased effort toward commercialization, and the market segments of quantum sensing, quantum computing, and quantum communications emerged.

Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64x400 Gbps or 32x800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their current form factors, pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.

Materials informatics is transforming how materials companies approach R&D, bringing data-centric approaches, including AI and machine learning, to materials science to reduce costs and develop new products faster.

By 2044, it is expected that the global trucking fleet will be supported by an additional half a million L4 autonomous drivers, while the remaining drivers will either act as supervisors or work in less developed regions. The autonomous truck industry is projected to have an annual growth rate of 25.6% over the next 20 years.

Thermal interface materials (TIMs) are composed of thermal fillers and matrix materials. Thermal fillers are highly thermally conductive substances, while matrix materials are typically used to enhance mechanical properties.