Semiconductors, Computing & AI

World's first flexible multi-functional timer to be distributed at Printed Electronics Europe.

SiC devices will be widely designed into electric vehicles from 2014 and GaN from 2018. With manufacturers currently designing vehicles to be launched onto the market in 2018, it is predicted that by this date GaN semiconductors will attain price parity with silicon devices. This will make the technology attractive as a replacement for silicon for use in the power electronics in both pure electric and hybrid vehicles.

As the next Printed Electronics Europe event is now less than 2 weeks away, it is opportune to take a closer look at the successes of the printed electronics industry in Europe. One of the areas where Europe is making a huge impact is in printed sensors.

In this article we share some of the findings in the new IDTechEx report "Future Mobile Phone/Cell Phone Technology and Functions 2014-2024".

The term the Internet of Things was conceived when the Massachusetts Institute of Technology set up the Auto ID Center in 1998.

There has been varying levels of interest in different types of energy harvesters over the past few years. For powering small or mobile devices, photovoltaics dominate - they are widely produced, robust and relatively low cost.

IDTechEx forecasts that the market for printed and flexible sensors will increase by more than $1 billion by 2020. This is one of the many findings discussed in the latest report "Printed and Flexible Sensors 2014-2024: Technologies, Players, Forecasts" (www.IDTechEx.com/sensors).

The Japanese are working very hard on thermoelectric energy harvesting from tiny forms for use on hot running electronics components the 1.5 kW versions for use on furnace flues etc.

IDTechEx has just completed an intense study of Printed Electronics in Japan involving 35 visits to companies and institutions there and interviews and lectures at the IDTechEx Printed Electronics Asia event there.