Semiconductors, Computing & AI

Quantum sensors promise to unlock new applications through dramatically increased sensitivity. Characterizing the quantum sensor market, quantum sensing technologies, and quantum sensor players, with report covers 17 quantum sensing technology areas along with applications in electric vehicles, GPS denied navigation, medical imaging, and quantum computing with market forecasts from 2024 to 2044.

Thursday 3 August 2023 - Materials and Processing Trends for 2.5D and 3D Semiconductor Packaging; An overview of advanced semiconductor packaging technology: landscape and development; Manufacturing methods and dielectric materials choice for 2.5D packaging; A review of 3D Cu-Cu bonding packaging technology: materials and manufacturing processes barriers and future trend

How far is printed/flexible electronics along the road to widespread adoption? The emerging manufacturing methodology, which replaces etched copper laminate with printed conductive inks on flexible substrates, offers multiple benefits, including flexibility/stretchability, the potential for low-cost roll-to-roll production, digital manufacturing/rapid prototyping, and improved sustainability.

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.

Thursday 27 July 2023 - Surging Demand for Lithium-Ion Batteries Driving the Carbon Nanotube Market. 10-year market outlook for CNTs; Analysis of CNT usage in the energy storage industry, including technology trends in LiBs and next generation batteries; Overview of other key applications; Discussion of key players and supply chain pain points; Emerging technologies incl. green feedstock

There is no denying that silicon carbide (SiC) MOSFETs are the story of the next decade for electric vehicle power electronics. The material improves powertrain efficiency (EV range), operates at higher voltages for faster charging, and creates new materials opportunities, such as Ag or Cu sintering, as power densities and operational temperatures increase.

In a recently published article, AI and Security: Ensuring That Opportunities Outweigh the Threats, IDTechEx discussed the importance of ownership and culpability when it comes to deploying AI tools, especially in the context of creative works. This matter of accountability and the potential insidious use of artificial intelligence in the creation of intellectual property is a theme touched on in the first episode of the new Black Mirror season, "Joan Is Awful".

The success of electric vehicles in the construction industry will largely be determined by battery prices being low enough that the total cost of ownership is cheaper than diesel alternatives.

This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging.