Data Centers

Thermal management technologies have a great prevalence across a number of sectors. This article covers some emerging thermal management methods taking place for EV batteries, data centers, and spacecrafts.

Quantum technology developments are creating opportunities for increased sensing sensitivity, extra secure communications, and high-speed computing. This article explores three of the main areas of quantum technology that are on the rise.

Semiconductors, co-packaged optics, and photonic integrated circuits are some of the research topics covered by IDTechEx showcasing the advancements being made in the semiconductor industry. This article explores some of the current trends and developments being made within the sector.

The demand for scalable and efficient storage is at an all-time high, with the strain on data centers becoming increasingly apparent. This article explores sustainable innovations for data centers, alongside cooling technologies.

With the increasing demand for semiconductors and data centers as memory and storage applications grow, there is a need for increased sustainability efforts. This article explores various approaches to reducing energy and emissions in semiconductor manufacturing processes and data centers.

There is an increasing need for efficient and scalable storage, necessary to keep up with the increasing demands of data storage that is becoming more prevalent each year. This article covers developments and demand for data centers, AI, and edge computing.

The data center cooling value chain is long, complicated, and chaotic, consisting of multiple stakeholders. Data center cooling happens on multiple levels including chip and server level, as well as the rack and facility level.

As well as being heroic in many ways, quantum technology could also be a large threat to security over the next 30 years when used to break cryptographic and authentication algorithms that many companies rely upon to keep data safe.

Photonic Integrated Circuits are photonic circuits formed on a semiconductor material that allows light to pass through it, such as silicon dioxide, also known as Silica (or Glass). These photonic circuits contain components for manipulating light passing through the circuit, enabling functionalities such as data transmission, sensing, and processing within a compact form factor. PICs are fundamentally altering how we manage and utilize optical signals, paving the way for advancements across multiple industries.

Thermal interface materials (TIMs) are composed of thermal fillers and matrix materials. Thermal fillers are highly thermally conductive substances, while matrix materials are typically used to enhance mechanical properties.