Data Centers

Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat sources and heat sinks to enhance heat transfer.

6G, compared to its predecessor, is expected to offer significantly better communication capabilities, such as Tbps-level peak data rates, microsecond-level latency, and 99.99999% network dependability.

Wednesday 15 March 2023 - Thermal Management Opportunities in Emerging Technology Markets. Key takeaways from the webinar; Electric vehicles (thermal management and fire protection); ADAS (advanced driver-assistance systems); 5G infrastructure; Data centers; Consumer electronics; Combined EMI shielding and TIM options

Battery thermal management is a critical component to an electric vehicles (EVs) operation. Cells need to be kept cool when under load from driving and charging or kept warm during cold ambient conditions. This enables more efficient operation of the batteries and improves safety.

Wednesday 8 February 2023 - Technological Developments and Applications. Contents that will be covered in this webinar include: An overview of PIC technology; Drivers of increased data demands from data centres; PIC trends in the communications industry; and PIC adoption in other markets

As high-performance computing, artificial intelligence and machine learning algorithms, and even consumers become increasingly data-hungry, hardware struggles to keep pace. In addition, the need for real-time assessments of moving data points - such as for the accurate velocity-mapping of other objects in autonomous systems and facial recognition for security systems - is crucial to an increasingly hands-free society.

IDTechEx have released a brand new report, "Quantum Computers 2023-2043". This report covers the hardware that promises a revolutionary approach to solving the world's unmet challenges.

Thermal management is critical in several industries, and the trends in emerging technologies are driving material innovation. Electronics in markets from personal devices through to cars are seeing increased integration, densification, and hence an increased focus on thermal management.

Two of the nine new rules stand out, given the scale of both the short-term and long-term impact that they will cause. IDTechEx assesses the impact of these changes.

In this article, IDTechEx will cover the growth drivers of advanced semiconductor packaging technologies on data center applications, as well as give several examples of cutting-edge commercial server products that adopt advanced semiconductor packaging technologies. The content of this article is from IDTechEx's newly released market research report, "Advanced semiconductor packaging 2022-2033".