Semiconductors

This paper first presented at EVS29 Montreal Canada provides an overview of the Fiscal Years 2015-2016 Hybrid and Electric Systems research and development activities - with emphasis on its advanced electric drive research -funded by the Vehicles Technologies Office of the U.S. Department of Energy.

A research team has developed a new approach to finding fields of helium underground, and with the first use of the technique they have discovered a massive reserve in East Africa according to a new report from Oxford University in the UK.

Helium has important applications in MRI machines, welding, manufacturing semiconductors, deep-sea diving and blimps. If it was readily available and affordable, its use in EVs such as underwater vehicles and aircraft would increase greatly.

The new IDTechEx report, Future Powertrains 2016-2031 concerns the twenty year future of powertrains for land vehicles, including reference to water and airborne vehicles as appropriate. The primary emphasis is on the most important applications by market value - cars and buses - and the most important powertrain types by value potential but most of this analysis is directly applicable to most other vehicles.

The new IDTechEx report, Future Powertrains 2016-2031 concerns the twenty year future of powertrains for land vehicles, including reference to water and airborne vehicles as appropriate.

LG Display is currently the only manufacturer of large OLED panels. But it is not just the rivalry with LG that will drive Samsung to invest in OLED production capacity.

The first industrial robot, Unimate, went into operation at a General Motors plant in 1961. Over the next few decades the use of industrial robot arms in the automotive industry matured.

Ever since Sony launched the first television with quantum dots in 2013, these highly engineered materials have been back in the spotlight.

Advanced microelectronics are moving on from the Moore's Law era to be More-than-Moore. Denser chips have higher internal and external clock rates, and higher power dissipation.

Large investments have been made to enable flexible, thin sensors rather than rigid sensors.