Semiconductors

The new IDTechEx report, "Emerging Image Sensor Technologies 2023-2033: Applications and Markets", explores a diverse range of image sensing technologies capable of resolutions and wavelength detection far beyond what is currently attainable.

As high-performance computing, artificial intelligence and machine learning algorithms, and even consumers become increasingly data-hungry, hardware struggles to keep pace. In addition, the need for real-time assessments of moving data points - such as for the accurate velocity-mapping of other objects in autonomous systems and facial recognition for security systems - is crucial to an increasingly hands-free society.

Thursday 15 December 2022 - Discussion of the incentives and opportunities of embracing sustainable electronics manufacturing; Additive manufacturing approaches for printed circuit boards; Novel approaches to manufacturing integrated circuits; What are key players doing to improve sustainability?; Roadmaps for the adoption of sustainable materials and processes

A new wave of electronics manufacturing is on the horizon, driven forward by volatile energy prices and increasing demand for sustainability. With the electronics industry accounting for 4% of global greenhouse gas emissions, it requires substantial innovation to reduce its environmental footprint.

The true description of graphene is that of a single atomic layer of carbon atoms arranged in a hexagonal array. However, the nanocarbon material landscape is much more complicated than this simple statement, with single-layer, few-layer, multi-layer, graphene nanoplatelets (GNPs) and both graphene oxide (GO) and reduced graphene oxide (rGO) all to be considered as types of graphene.

In this article, IDTechEx will cover the growth drivers of advanced semiconductor packaging technologies on data center applications, as well as give several examples of cutting-edge commercial server products that adopt advanced semiconductor packaging technologies. The content of this article is from IDTechEx's newly released market research report, "Advanced semiconductor packaging 2022-2033".

Thursday 25 August 2022 - Analysis of advanced semiconductor packaging markets and their mid-long-term opportunity; Key applications' growth drivers; Player analysis - the dynamics of advanced semiconductor packaging battleground; Advanced semiconductor packaging technologies - current challenges and innovative trends

If the future were to be categorized in one word, it would be "data-centric". IC vendors have been pushed towards "advanced semiconductor packaging" to meet the world's data needs.

Whilst much of the "5G" infrastructure is a moderate upgrade on existing 4G technology, there is still plenty of scope for higher frequency deployment such as mmWave devices and very different station types such as small cells. Each of these new developments presents its own technological evolution and with it, thermal challenges.

Air quality concerns are on the rise globally, with urban pollution the dominant cause. However, radon accumulation and unpleasant aromas are often bigger problems in rural locations, creating opportunities for gas sensors that offer continuous monitoring and even odor categorization.