Tuesday 13 May 2025 - Are Metal-Organic Frameworks (MOFs) Ready for Large Scale Commercialization?; An overview of emerging MOF-based technologies approaching commercialization; Material choices and considerations for MOFs in key applications, such as carbon capture and water harvesting; Scaling MOF production for industrial applications; Market status and outlook for MOF demand based on IDTechEx forecasts

The rise of QLC SSDs is challenging hard disk drives in cold storage and beyond. IDTechEx explores how performance, density, and cost are shifting the economics of data storage.

The ability of PICs to precisely manipulate light at the chip level opens the door to various cutting-edge fields beyond data communication, including sensing, LiDAR, quantum computing, and high-performance computing (HPC).While PIC-based transceivers are set to dominate the market, with long-range transceivers for 5G/6G networks forming the second largest sector of the overall market, other applications for PIC are growing steadily.

Conventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.

At GTC 2025, NVIDIA announced two new networking switch platforms - Spectrum-X Photonics and Quantum-X Photonics - based on Co-Packaged Optics (CPO) technology. Both platforms incorporate TSMC's 3D hybrid bonding technology for its CPO, and these will be the world's first 3D-stacked silicon photonics engine.

With the introduction of collaborative robots and AI agents, household chores could also become a display of the latest intelligent robotics technology. From companionship robots that engage in conversation and play board games to cars that drive themselves safely using radar and artificial intelligence, the possibilities for robotics are endless.