Thursday 3 August 2023 - Materials and Processing Trends for 2.5D and 3D Semiconductor Packaging; An overview of advanced semiconductor packaging technology: landscape and development; Manufacturing methods and dielectric materials choice for 2.5D packaging; A review of 3D Cu-Cu bonding packaging technology: materials and manufacturing processes barriers and future trend

How far is printed/flexible electronics along the road to widespread adoption? The emerging manufacturing methodology, which replaces etched copper laminate with printed conductive inks on flexible substrates, offers multiple benefits, including flexibility/stretchability, the potential for low-cost roll-to-roll production, digital manufacturing/rapid prototyping, and improved sustainability.

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.

Thursday 27 July 2023 - Surging Demand for Lithium-Ion Batteries Driving the Carbon Nanotube Market. 10-year market outlook for CNTs; Analysis of CNT usage in the energy storage industry, including technology trends in LiBs and next generation batteries; Overview of other key applications; Discussion of key players and supply chain pain points; Emerging technologies incl. green feedstock

There is no denying that silicon carbide (SiC) MOSFETs are the story of the next decade for electric vehicle power electronics. The material improves powertrain efficiency (EV range), operates at higher voltages for faster charging, and creates new materials opportunities, such as Ag or Cu sintering, as power densities and operational temperatures increase.

In a recently published article, AI and Security: Ensuring That Opportunities Outweigh the Threats, IDTechEx discussed the importance of ownership and culpability when it comes to deploying AI tools, especially in the context of creative works. This matter of accountability and the potential insidious use of artificial intelligence in the creation of intellectual property is a theme touched on in the first episode of the new Black Mirror season, "Joan Is Awful".

The success of electric vehicles in the construction industry will largely be determined by battery prices being low enough that the total cost of ownership is cheaper than diesel alternatives.

This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging.

Anyone with access to social media platforms will likely have heard of ChatGPT by now. Created by OpenAI and released in November 2022, the generative AI tool had 100 million registered users as of three months after release, with it - the world's most advanced chatbot - being used to answer simple queries, write songs, and draft press releases, all with varying degrees of success.

In this complimentary whitepaper, Dr Tess Skyrme outlines the specific applications for quantum computing within the automotive industry.

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

Computer chips have been part of cars for a long time, but no one really cares about them until they stop working or they are late to the production line, grinding manufacturing to an industry-shaking halt

While the current AI boom is only just getting started, an early winner is Nvidia, who - on Tuesday, May 30th - saw the company's market capitalization exceed US$1 trillion for the first time. For a chip designer with no fabrication capabilities of its own, this is a significant moment.

Wednesday 21 June 2023 - IDTechEx's Key Semiconductor Trends in Edge AI, Automotive, and Advanced Semiconductor Packaging. AI-crucial technologies, such as autonomous driving, and the current state of the technology landscape; AI as enablers of new functionalities at the edge, such as for the smartphone market; Requirements for AI hardware at the edge; Semiconductor technologies used in autonomous vehicles; Capabilities of automotive semiconductor suppliers and the role of foundries; Key technology trend in semiconductor packaging; Growth drivers in main application areas for advanced semiconductor packaging: high performance computing (HPC) applications/data centers, communication networks, autonomous cars, and consumer electronics

Like many industries, the construction vehicle and machine industry is on the path to electrification. It has been one of the latecomers to the electrification game, with little happening from OEMs until after 2020. But this is changing, with more electric product announcements covering a wider selection of vehicle types under the construction banner.

Wednesday 7 June 2023 - AI capabilities and why these matter; The link between AI and semiconductor manufacture; Reasons for government funding initiatives into shoring up domestic semiconductor supply chain capabilities; Outlook, both with regards to the effectiveness of these campaigns, as well as the global semiconductor supply chain and AI chips until 2033.

With the high inflation, increasing labor costs, labor shortage, energy crisis, and hybrid working, the manufacturing industry experienced significant turmoil in 2022. Although some of these have started to get eased, 2023 is still expected to be a challenging year for the manufacturing industry.

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.

Microcontrollers (also known as controllers, MCUs and other name variations) are the backbone on which modern vehicles are built. Regardless of whether a car is powered by petrol, diesel, electric, hydrogen, PDG, or anything else, its functionalities will be heavily dependent on controllers.