This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging.

Anyone with access to social media platforms will likely have heard of ChatGPT by now. Created by OpenAI and released in November 2022, the generative AI tool had 100 million registered users as of three months after release, with it - the world's most advanced chatbot - being used to answer simple queries, write songs, and draft press releases, all with varying degrees of success.

In this complimentary whitepaper, Dr Tess Skyrme outlines the specific applications for quantum computing within the automotive industry.

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

Computer chips have been part of cars for a long time, but no one really cares about them until they stop working or they are late to the production line, grinding manufacturing to an industry-shaking halt

While the current AI boom is only just getting started, an early winner is Nvidia, who - on Tuesday, May 30th - saw the company's market capitalization exceed US$1 trillion for the first time. For a chip designer with no fabrication capabilities of its own, this is a significant moment.

Wednesday 21 June 2023 - IDTechEx's Key Semiconductor Trends in Edge AI, Automotive, and Advanced Semiconductor Packaging. AI-crucial technologies, such as autonomous driving, and the current state of the technology landscape; AI as enablers of new functionalities at the edge, such as for the smartphone market; Requirements for AI hardware at the edge; Semiconductor technologies used in autonomous vehicles; Capabilities of automotive semiconductor suppliers and the role of foundries; Key technology trend in semiconductor packaging; Growth drivers in main application areas for advanced semiconductor packaging: high performance computing (HPC) applications/data centers, communication networks, autonomous cars, and consumer electronics

Like many industries, the construction vehicle and machine industry is on the path to electrification. It has been one of the latecomers to the electrification game, with little happening from OEMs until after 2020. But this is changing, with more electric product announcements covering a wider selection of vehicle types under the construction banner.

Wednesday 7 June 2023 - AI capabilities and why these matter; The link between AI and semiconductor manufacture; Reasons for government funding initiatives into shoring up domestic semiconductor supply chain capabilities; Outlook, both with regards to the effectiveness of these campaigns, as well as the global semiconductor supply chain and AI chips until 2033.

With the high inflation, increasing labor costs, labor shortage, energy crisis, and hybrid working, the manufacturing industry experienced significant turmoil in 2022. Although some of these have started to get eased, 2023 is still expected to be a challenging year for the manufacturing industry.

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.

Microcontrollers (also known as controllers, MCUs and other name variations) are the backbone on which modern vehicles are built. Regardless of whether a car is powered by petrol, diesel, electric, hydrogen, PDG, or anything else, its functionalities will be heavily dependent on controllers.

Artificial Intelligence has come a long way since the success of DeepMind over Go world champion Lee Sedol in 2016; the world is beginning to change according to the new possibilities afforded by AI. From the robust predictive abilities of OpenAI's ChatGPT - where the AI chatbot can be used for all sorts of purposes, from creating scripts (including malware) to writing academic essays - to AI image generators that are so good that they can win Sony world photography awards, the complexity and capabilities of AI algorithms are growing at a startlingly fast pace.

Materials informatics is the application of data-driven methods, including machine learning techniques, to the field of materials science. This important part of the digital transformation toolbox for the materials industry has wide-ranging benefits, but the ability to enhance the sustainability of materials and their manufacturing processes could be the most impactful of these.

6G is the next generation of wireless technology that promises to go beyond mobile communication and revolutionize how people interact with the world around them. According to IDTechEx's latest 6G research, 6G could be with us in 2028 at the earliest.

IDTechEx's new report "Semiconductors for Autonomous and Electric Vehicles 2023-2033" finds that the coming mass adoption of electric vehicles will drive a 10-year CAGR of 20.9% in semiconductors used for electric powertrains. Along with the rise of more autonomous vehicles, this will drive the overall automotive semiconductor market to a CAGR of 9.4% over the next decade.

Modern technology is largely built upon the back of tiny electrical circuits connected together to form chips. These come in a variety of configurations, and can be found in all kinds of household appliances (from rice cookers to air conditioners), consumer electronics (laptops, smartphones, TVs), and products and services necessary to everyday life in an interconnected world (such as airplanes, trains, and cars).

Thermal Interface Materials (TIMs) come in different forms and thermal conductivities. Typical TIM forms include gap pads, thermal greases, thermally conductive adhesives (TCA), and phase change materials.

As electric vehicle (EV) power electronics undergoes a paradigm shift towards wide bandgap (WBG) semiconductors, it is clear that silicon carbide (SiC) is becoming the material of choice, while gallium nitride (GaN) is often shoe-boxed into telecommunications or optoelectronics applications.

Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat sources and heat sinks to enhance heat transfer.